Joungho Choi,: шукати на сайті Z-Library

Пожертвування 15 вересня 2024 – 1 жовтня 2024 Про збір коштів

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

Підтримати

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Статті (155)
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1

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Statistical eye-diagram estimation method for high-speed channel with N-tap decision feedback equalizer (DFE)

Park, Junyong, Song, Huijin, Kim, Dong-Hyun, Choi, Sumin, Kim, Joungho

Рік:

2018

Мова:

english

Файл:

PDF, 1.51 MB

english, 2018

2

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board

Lee, H., Jonghoon Kimi,, Seungyoung Ahn,, Jung-Gun Byun,, Deog-Soo Kang,, Cheol-Seung Choi,, Hae-Jin Hwang,, Joungho Kim,

Рік:

2001

Мова:

english

Файл:

PDF, 410 KB

english, 2001

3

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Bias-dependent power distribution network impedance analysis with MOS capacitor

Kim, Dong-Hyun, Kim, Subin, Park, Junyong, Kim, Youngwoo, Choi, Sumin, Cho, Kyungjun, Kim, Joungho

Рік:

2018

Файл:

PDF, 156 KB

2018

4

[IEEE 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Montreal, QC, Canada (2019.10.6-2019.10.9)] 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box

Son, Kyungjune, Choi, Sumin, Jung, Daniel Hyunsuk, Kim, Keunwoo, Park, Gapyeol, Lho, Daehwan, Park, Hyunwook, and, Shinyoung Park, Kim, Joungho, Cho, Youngje, Park, Byungsoo, Choi, Seongmin

Рік:

2019

Файл:

PDF, 1.33 MB

2019

5

RF interconnect for multi-gbit/s board-level clock distribution

Woonghwan Ryu,, Junwoo Lee,, Hyungsoo Kim,, Seungyoung Ahn,, Namhoon Kim,, Baekkyu Choi,, Donggun Kam,, Joungho Kim,

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2000

Мова:

english

Файл:

PDF, 651 KB

english, 2000

6

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Seungyoung Ahn,, Junho Lee,, Junwoo Lee,, Jonghoon Kim,, Woonghwan Ryu,, Byung-Hun Kum,, Hyun-Seok Choi,, Chong K. Yoon,, Joungho Kim,

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2003

Мова:

english

Файл:

PDF, 815 KB

english, 2003

7

Microwave frequency crosstalk model of redistribution line patterns on wafer level package

Myunghee Sung,, Namhoon Kim,, Junwoo Lee,, Hyungsoo Kim,, Baek Kyu Choi,, Jae-Myun Kim,, Joon-Ki Hong,, Joungho Kim,

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2002

Мова:

english

Файл:

PDF, 625 KB

english, 2002

8

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D and 3D IC

Choi, Sumin, Kim, Heegon, Jung, Daniel H., Kim, Jonghoon J., Lim, Jaemin, Lee, Hyunsuk, Cho, Kyungjun, Kim, Joungho

Рік:

2016

Файл:

PDF, 781 KB

2016

9

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J., Kim, Heegon, Jung, Daniel H., Choi, Sumin, Lim, Jaemin, Kim, Youngwoo, Park, Junyong, Kim, Hyesoo, Ha, Dongho, Bae, Michael, Kim, Joungho

Журнал:

IEEE Transactions on Electromagnetic Compatibility

Рік:

2017

Мова:

english

Файл:

PDF, 2.75 MB

english, 2017

10

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Design and analysis of silicone rubber-based TERAPOSER for LPDDR4 memory test

Kim, Jonghoon J., Kim, Heegon, Jung, Daniel H., Choi, Sumin, Jaemin,, Park, Junyong, Kim, Jiseong, Kim, Joungho, Ha, Dongho, Bae, Michael

Рік:

2016

Мова:

english

Файл:

PDF, 709 KB

english, 2016

11

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

Choi, Sumin, Kim, Heegon, Kim, Kiyeong, Park, Junyong, Jung, Daniel H., Kim, Joungho

Рік:

2017

Мова:

english

Файл:

PDF, 1.06 MB

english, 2017

12

[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining, Hangzhou, China (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)

Cho, Kyungjun, Kim, Youngwoo, Lee, Hyunsuk, Park, Gapyeol, Kim, Subin, Son, Kyungjune, Choi, Sumin, Kim, Joungho

Рік:

2017

Файл:

PDF, 812 KB

2017

13

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Estimation and analysis of crosstalk effects in high-bandwidth memory channel

Choi, Sumin, Kim, Heegon, Park, Junyong, Kim, Dong-Hyun, Jung, Daniel H., Lim, Jaemin, Cho, Kyungjun, Kim, Joungho

Рік:

2018

Мова:

english

Файл:

PDF, 229 KB

english, 2018

14

[IEEE 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Reno, NV, USA (2020.7.28-2020.8.28)] 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - An Induction Heating System Analysis Method based on Operating Conditions

Kang, Hyungmin, Lho, Daehwan, Park, Hyunwook, Kong, Taewoong, Choi, Hyojin, Kim, Joungho

Рік:

2020

Файл:

PDF, 600 KB

2020

15

Disseminated dendriform pulmonary ossification associated with usual interstitial pneumonia: incidence and thin-section CT–pathologic correlation

Tae Sung Kim, Joungho Han, Man Pyo Chung, Myung Jin Chung, Yong Soo Choi

Журнал:

European Radiology

Рік:

2005

Мова:

english

Файл:

PDF, 314 KB

english, 2005

16

Measurement and Analysis of a High-Speed TSV Channel

Kim, Heegon, Cho, Jonghyun, Kim, Myunghoi, Kim, Kiyeong, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Choi, Kwangseong, Bae, Hyun-Cheol, Kim, Joungho, Kim, Jiseong

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2012

Мова:

english

Файл:

PDF, 2.36 MB

english, 2012

17

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board

Jonghoon Kim,, Baekkyu Choi,, Hyungsoo Kim,, Woonghwan Ryu,, Young-hwan Yun,, Seog-heon Ham,, Soo-Hyung Kim,, Yong-hee Lee,, Joungho Kim,

Рік:

2001

Мова:

english

Файл:

PDF, 572 KB

english, 2001

18

[IEEE 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Nara, Japan (2013.12.15-2013.12.18)] 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Modeling and analysis of open defect in through silicon via (TSV) channel

Jung, Daniel H., Heegon Kim,, Kim, Jonghoon J., Joungho Kim,, Hyun-Cheol Bae,, Kwang-Seong Choi,

Рік:

2013

Мова:

english

Файл:

PDF, 557 KB

english, 2013

19

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi,, Dong Gun Kam,, Daehyun Chung,, Srinivasan, K., Govind, V., Joungho Kim,, Swaminathan, M.

Рік:

2005

Мова:

english

Файл:

PDF, 2.68 MB

english, 2005

20

[IEEE 2012 IEEE MTT-S International Microwave Workshop Series on Innovative Wireless Power Transmission: Technologies, Systems, and Applications (IMWS 2012) - Kyoto, Japan (2012.05.10-2012.05.11)] 2012 IEEE MTT-S International Microwave Workshop Series on Innovative Wireless Power Transmission: Technologies, Systems, and Applications - Reduction of electromagnetic field (EMF) of wireless power transfer system using quadruple coil for laptop applications

Ahn, Seungyoung, Park, Hyun Ho, Choi, Cheol-Seung, Kim, Jonghoon, Song, Eakhwan, Park, Hark Byung, Kim, Hongseok, Kim, Joungho

Рік:

2012

Мова:

english

Файл:

PDF, 1.03 MB

english, 2012

21

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Experimental investigation of radiated emission from flexible printed circuit (FPC) cable

Seungyoung Ahn,, Jonghoon Kim,, Heeseok Lee,, Joungho Kim,, Jung-Gun Byun,, Cheol-Seung Choi,, Hae-Jin Hwang,

Рік:

2002

Мова:

english

Файл:

PDF, 444 KB

english, 2002

22

[IEEE 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Nara, Japan (2013.12.15-2013.12.18)] 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

Kim, Heegon, Cho, Jonghyun, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Kim, Joungho, Lee, Junho, Park, Kunwoo

Рік:

2013

Мова:

english

Файл:

PDF, 1.81 MB

english, 2013

23

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Choi, Jinwoo, Kam, Dong Gun, Chung, Daehyun, Srinivasan, Krishna, Govind, Vinu, Kim, Joungho, Swaminathan, Madhavan

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2007

Мова:

english

Файл:

PDF, 1.76 MB

english, 2007

24

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

Heegon Kim,, Jonghyun Cho,, Joohee Kim,, Sumin Choi,, Kiyeong Kim,, Junho Lee,, Kunwoo Park,, Pak, Jun So, Joungho Kim,

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2015

Мова:

english

Файл:

PDF, 3.46 MB

english, 2015

25

[IEEE 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Taipei, Taiwan (2015.5.26-2015.5.29)] 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Signal integrity design of bump-less interconnection for high-speed signaling in 2.5D and 3D IC

Lee, Hyunsuk, Kim, Heegon, Choi, Sumin, Kim, Dong-Hyun, Cho, Kyungjun, Kim, Joungho

Рік:

2015

Мова:

english

Файл:

PDF, 466 KB

english, 2015

26

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Radiated emission from plasma display panel (PDP) depending on addressing line structure and current driving scheme

Youchul Jeong,, Junwoo Lee,, Jingook Kim,, Suna Choi,, Joungho Kim,, Hyun Ho Park,, Kyungho Kang,, Heehwan Kim,, Kiwoong Whang,

Рік:

2002

Мова:

english

Файл:

PDF, 265 KB

english, 2002

27

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

Seungyong Baek,, Dong Gun Kam,, Bongcheol Park,, Joungho Kim,, Jung-Gun Byun,, Cheol-Seung Choi,

Рік:

2002

Мова:

english

Файл:

PDF, 325 KB

english, 2002

28

[IEEE 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Edinburgh, United Kingdom (2015.11.10-2015.11.13)] 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC

Lim, Jaemin, Lee, Manho, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Lee, Hyunsuk, Kim, Joungho

Рік:

2015

Мова:

english

Файл:

PDF, 506 KB

english, 2015

29

[IEEE 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Edinburgh, United Kingdom (2015.11.10-2015.11.13)] 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC

Kim, Jonghoon J., Jung, Daniel H., Kim, Heegon, Kong, Sunkyu, Choi, Sumin, Lim, Jaemin, Kim, Joungho

Рік:

2015

Мова:

english

Файл:

PDF, 489 KB

english, 2015

30

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Lee, Hyunsuk, Kim, Heegon, Kim, Kiyeong, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Lim, Jaemin, Kim, Joungho, Kim, Hyungsoo, Park, Kunwoo

Рік:

2014

Мова:

english

Файл:

PDF, 1.00 MB

english, 2014

31

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module

Lee, Hyunsuk, Cho, Kyungjun, Kim, Heegon, Choi, Sumin, Lim, Jaemin, Kim, Joungho

Рік:

2015

Мова:

english

Файл:

PDF, 467 KB

english, 2015

32

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Modeling and analysis of high-speed through silicon via (TSV) channel and defects

Jung, Daniel H., Kim, Jonghoon J., Kim, Heegon, Choi, Sumin, Lim, Jaemin, Kim, Joungho, Bae, Hyun-Cheol, Choi, Kwang-Seong

Рік:

2016

Мова:

english

Файл:

PDF, 643 KB

english, 2016

33

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel H., Kim, Youngwoo, Kim, Jonghoon J., Kim, Heegon, Choi, Sumin, Song, Yoon-Ho, Bae, Hyun-Cheol, Choi, Kwang-Seong, Piersanti, Stefano, de Paulis, Francesco, Orlandi, Antonio, Kim, Joungho

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2017

Мова:

english

Файл:

PDF, 4.03 MB

english, 2017

34

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5D Terabtye/s bandwidth system

Cho, Kyungjun, Kim, Youngwoo, Kim, Subin, Lee, Hyunsuk, Choi, Sumin, Kim, Heegon, Kim, Joungho

Рік:

2016

Мова:

hausa

Файл:

PDF, 665 KB

hausa, 2016

35

[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI, USA (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

Lee, Hyunsuk, Cho, Kyungjun, Kim, Heegon, Choi, Sumin, Lim, Jaemin, Shim, Hyunwoo, Kim, Joungho

Рік:

2016

Мова:

english

Файл:

PDF, 3.10 MB

english, 2016

36

[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Design and verification of a high-speed connector for multi-media system

Song, Huijin, Kim, Jonghoon J., Park, Junyong, Kim, Joungho, Lee, Junho, Choi, Seongmin

Рік:

2017

Файл:

PDF, 574 KB

2017

37

[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity

Kumar, Gaurav, Park, Gapyeol, Park, Hyunwook, Lho, Daehwan, Park, Junyong, Kim, Joungho, Lee, Junho, Choi, Seongmin

Рік:

2019

Файл:

PDF, 601 KB

2019

38

[IEEE 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Reno, NV, USA (2020.7.28-2020.8.28)] 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle

Kim, Subin, Shin, Taein, Jeong, Seungtaek, Kang, Hyungmin, Son, Keeyoung, Park, Shinyoung, Kim, Hyunho, Choi, Jaegi, Kim, Minkyu, Kim, Hoon, Kim, Joungho

Рік:

2020

Файл:

PDF, 1.25 MB

2020

39

A proposal for combined MRI and PET/CT interpretation criteria for preoperative nodal staging in non-small-cell lung cancer

Kim, Yoo Na, Yi, Chin A, Lee, Kyung Soo, Kwon, O Jung, Lee, Ho Yun, Kim, Byung-Tae, Choi, Joon Young, Kim, Seon Woo, Chung, Man Pyo, Han, Joungho, Kim, Tae Sung, Chung, Myung Jin, Shim, Young Mog

Журнал:

European Radiology

Рік:

2012

Мова:

english

Файл:

PDF, 399 KB

english, 2012

40

Neurologic outcomes of thymectomy in myasthenia gravis: Comparative analysis of the effect of thymoma

Hong Kwan Kim, Min Soo Park, Yong Soo Choi, Kwhanmien Kim, Young Mog Shim, Joungho Han, Byoung Joon Kim, Jhingook Kim

Журнал:

The Journal of Thoracic and Cardiovascular Surgery

Рік:

2007

Мова:

english

Файл:

PDF, 503 KB

english, 2007

41

Type B thymoma: Is prognosis predicted only by World Health Organization classification?

Hong Kwan Kim, Yong Soo Choi, Jhingook Kim, Young Mog Shim, Joungho Han, Kwhanmien Kim

Журнал:

The Journal of Thoracic and Cardiovascular Surgery

Рік:

2010

Мова:

english

Файл:

PDF, 312 KB

english, 2010

42

A potential case of intraductal tubulopapillary neoplasms of the bile duct

Hee Jung Park, Kee-Taek Jang, Jin Seok Heo, Yoon-La Choi, Joungho Han, Seong Hyun Kim

Журнал:

Pathology International

Рік:

2010

Мова:

english

Файл:

PDF, 1.37 MB

english, 2010

43

Treatment of Inflammatory Myofibroblastic Tumor of the Chest: The Extent of Resection

Hyun Joo Lee, Jin Shun Kim, Yong Soo Choi, Kwhanmien Kim, Young Mog Shim, Joungho Han, Jhingook Kim

Журнал:

The Annals of Thoracic Surgery

Рік:

2007

Мова:

english

Файл:

PDF, 62 KB

english, 2007

44

CASE REPORT: Extralobar pulmonary sequestration presenting a paravertebral mass with extensive fibroadenomatous change in an adult

Song Yi Choi, Jungsuk An, Jae Jun Lee, Joungho Han, Young Mog Shim, Chin A. Yi

Журнал:

Basic and Applied Pathology

Рік:

2010

Мова:

english

Файл:

PDF, 291 KB

english, 2010

45

Merkel cell carcinoma: Our experience with seven patients in Korea and a literature review

Kyong-Je Woo, Yoon-La Choi, Hun Soon Jung, Gyeongseo Jung, Young Kee Shin, Kee-Taek Jang, Joungho Han, Jai-Kyong Pyon

Журнал:

Journal of Plastic, Reconstructive & Aesthetic Surgery

Рік:

2010

Мова:

english

Файл:

PDF, 1.55 MB

english, 2010

46

Lung adenocarcinoma as a solitary pulmonary nodule: Prognostic determinants of CT, PET, and histopathologic findings

Lee, Ho Yun, Han, Joungho, Lee, Kyung Soo, Koo, Ji Hyun, Jeong, Sun Young, Kim, Byung-Tae, Cho, Young-Seok, Shim, Young Mog, Kim, Jhingook, Kim, Kwanmien, Choi, Yong Soo

Журнал:

Рік:

2009

Мова:

english

Файл:

PDF, 866 KB

english, 2009

47

Chemotherapy for pulmonary large cell neuroendocrine carcinoma: Similar to that for small cell lung cancer or non-small cell lung cancer?

Sun, Jong-Mu, Ahn, Myung-Ju, Ahn, Jin Seok, Um, Sang-Won, Kim, Hojoong, Kim, Hong Kwan, Choi, Young Soo, Han, Joungho, Kim, Jhingook, Kwon, O Jung, Shim, Young Mog, Park, Keunchil

Журнал:

Рік:

2012

Мова:

english

Файл:

PDF, 656 KB

english, 2012

48

Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee

Журнал:

IEEE Design & Test of Computers

Рік:

2006

Мова:

english

Файл:

PDF, 1.02 MB

english, 2006

49

A Single-Tube Multiplexed Assay for Detecting ALK, ROS1, and RET Fusions in Lung Cancer

Lira, Maruja E., Choi, Yoon-La, Lim, Sun Min, Deng, Shibing, Huang, Donghui, Ozeck, Mark, Han, Joungho, Jeong, Ji Yun, Shim, Hyo Sup, Cho, Byoung Chul, Kim, Jhingook, Ahn, Myung-Ju, Mao, Mao

Журнал:

The Journal of Molecular Diagnostics

Рік:

2014

Мова:

english

Файл:

PDF, 1.60 MB

english, 2014

50

Clinical characteristics associated with ALK rearrangements in never-smokers with pulmonary adenocarcinoma

Sun, Jong-Mu, Lira, Maruja, Pandya, Kinnari, Choi, Yoon-La, Ahn, Jin Seok, Mao, Mao, Han, Joungho, Park, Keunchil, Ahn, Myung-Ju, Kim, Jhingook

Журнал:

Рік:

2014

Мова:

english

Файл:

PDF, 599 KB

english, 2014